Will the Minister of Electronics and Information Technology be pleased to state:
(a) whether the Government is planning to set up a semi-conductor wafer fabrication facility in Gujarat;
(b) if so, the details thereof; and
(c) if not, the reasons therefor?
(a), (b), (c): Letters of Intent (LoI) dated 19.03.2014 were issued to the two business consortia, one led by M/s. Jaiprakash Associates Limited (with IBM, USA and Tower Semiconductor Limited, Israel as partners and proposed location as Uttar Pradesh) and the other led by M/s. HSMC Technologies India Pvt. Ltd. (with ST Microelectronics and Silterra Malaysia Sdn. Bhd. as partners and proposed location as Prantij, Gujarat) for setting up semiconductor wafer fabrication (FAB) facilities. Both the consortia were required to take certain actions and submit the requisite documents, as enunciated in the LoI for demonstration of commitment. Both the consortia sought extensions on multiple occasions for submission of requisite documents for demonstration of commitment, which were provided to them. The consortium led by M/s. Jaiprakash Associates Ltd. withdrew from the project on 02nd March, 2016. The consortium led by M/s. HSMC Technologies India Pvt. Ltd. was given a final extension until 28th February, 2017 for submission of the documents for demonstration of commitment. However, the consortium led by M/s. HSMC Technologies India Pvt. Ltd. has not submitted the requisite documents for demonstration of commitment.
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